Part Details for LPC1768FET100 by NXP Semiconductors
Overview of LPC1768FET100 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for LPC1768FET100
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Chip 1 Exchange | INSTOCK | 800 |
|
RFQ | |
|
CHIPMALL.COM LIMITED | TFBGA-100 Microcontroller Units (MCUs/MPUs/SOCs) ROHS | 463 |
|
$8.9661 / $14.9589 | Buy Now |
|
Win Source Electronics | IC MCU 32BIT 512KB FLASH 100BGA | 22503 |
|
$10.1090 / $12.7180 | Buy Now |
Part Details for LPC1768FET100
LPC1768FET100 CAD Models
LPC1768FET100 Part Data Attributes
|
LPC1768FET100
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
LPC1768FET100
NXP Semiconductors
32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-926-1, TFBGA-100
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 100 | |
Manufacturer Package Code | SOT-926-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B100 | |
Length | 9 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 70 | |
Number of Terminals | 100 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.2 mm | |
Speed | 100 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.4 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 9 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |