Part Details for ADSP-BF533SBBCZ500 by Rochester Electronics LLC
Overview of ADSP-BF533SBBCZ500 by Rochester Electronics LLC
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Part Details for ADSP-BF533SBBCZ500
ADSP-BF533SBBCZ500 CAD Models
ADSP-BF533SBBCZ500 Part Data Attributes:
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ADSP-BF533SBBCZ500
Rochester Electronics LLC
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Datasheet
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ADSP-BF533SBBCZ500
Rochester Electronics LLC
16-BIT, 40 MHz, OTHER DSP, PBGA160, ROHS COMPLIANT, MO-205AE, CSBGA-160
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| Additional Feature | ALSO REQUIRES 3V OR 3.3V SUPPLY | |
| Address Bus Width | 19 | |
| Barrel Shifter | YES | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B160 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 160 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 1.45 V | |
| Supply Voltage-Min | 0.8 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |