XCKU15P-L2FFVA1156E vs XCKU15P-L2FFVE1517E feature comparison

XCKU15P-L2FFVA1156E AMD Xilinx

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XCKU15P-L2FFVE1517E AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Date Of Intro 2016-06-03 2016-06-03
Additional Feature ALSO OPERATES AT 0.85V NOMINAL SUPPLY ALSO OPERATES AT 0.85V NOMINAL SUPPLY
JESD-30 Code S-PBGA-B1156 S-PBGA-B1517
JESD-609 Code e1 e1
Length 35 mm 40 mm
Moisture Sensitivity Level 4 4
Number of CLBs 65340 65340
Number of Inputs 668 668
Number of Logic Cells 1143450 1143450
Number of Outputs 668 668
Number of Terminals 1156 1517
Operating Temperature-Max 110 °C 110 °C
Operating Temperature-Min
Organization 65340 CLBs 65340 CLBs
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1517,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.71 mm 3.51 mm
Supply Voltage-Max 0.742 V 0.742 V
Supply Voltage-Min 0.698 V 0.698 V
Supply Voltage-Nom 0.72 V 0.72 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 40 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare XCKU15P-L2FFVE1517E with alternatives