XC7A200T-2FF1156I vs XC7A200T-2FFG1156I feature comparison

XC7A200T-2FF1156I AMD Xilinx

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XC7A200T-2FFG1156I AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description PACKAGE-1156
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2018-02-27
Combinatorial Delay of a CLB-Max 1.05 ns 1.05 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e0 e1
Length 35 mm 35 mm
Number of CLBs 16825 16825
Number of Terminals 1156 1156
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16825 CLBS 16825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.1 mm 3.1 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 1156
Clock Frequency-Max 1286 MHz
Moisture Sensitivity Level 4
Number of Inputs 500
Number of Logic Cells 215360
Number of Outputs 500
Package Equivalence Code BGA1156,34X34,40
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC7A200T-2FFG1156I with alternatives