XC3S1500L-4FG676C vs XA3S1500-4FGG676I feature comparison

XC3S1500L-4FG676C AMD Xilinx

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XA3S1500-4FGG676I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-676 LEAD FREE, FBGA-676
Pin Count 676 676
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3328 3328
Number of Equivalent Gates 1500000 1500000
Number of Inputs 487 487
Number of Logic Cells 29952 29952
Number of Outputs 487 487
Number of Terminals 676 676
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3328 CLBS, 1500000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 1
Pbfree Code Yes
ECCN Code 3A991.D
Factory Lead Time 52 Weeks
Clock Frequency-Max 125 MHz
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3S1500L-4FG676C with alternatives

Compare XA3S1500-4FGG676I with alternatives