XC3S1500L-4FG456C vs XC3S1500-4FG456I feature comparison

XC3S1500L-4FG456C AMD Xilinx

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XC3S1500-4FG456I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-456 23 X 23 MM, FBGA-456
Pin Count 456 456
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3328 3328
Number of Equivalent Gates 1500000 1500000
Number of Inputs 333 333
Number of Logic Cells 29952 29952
Number of Outputs 333 333
Number of Terminals 456 456
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 3328 CLBS, 1500000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1
Pbfree Code No
ECCN Code 3A991.D
Factory Lead Time 52 Weeks
Clock Frequency-Max 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V

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