XC3S1500L-4FG456C vs XC3S1400A-4FG484I feature comparison

XC3S1500L-4FG456C AMD Xilinx

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XC3S1400A-4FG484I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-456 FBGA-484
Pin Count 456 484
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B456 S-PBGA-B484
JESD-609 Code e0 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3328 2816
Number of Equivalent Gates 1500000 1400000
Number of Inputs 333 375
Number of Logic Cells 29952 25344
Number of Outputs 333 288
Number of Terminals 456 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3328 CLBS, 1500000 GATES 2816 CLBS, 1400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1
Pbfree Code No
ECCN Code 3A991.D
Factory Lead Time 12 Weeks
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.71 ns
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V

Compare XC3S1500L-4FG456C with alternatives

Compare XC3S1400A-4FG484I with alternatives