XC3S1500-5FGG456C vs XC3S1500L-4FG456C feature comparison

XC3S1500-5FGG456C AMD Xilinx

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XC3S1500L-4FG456C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, LEAD FREE, FBGA-456 FBGA-456
Pin Count 456 456
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 725 MHz
Combinatorial Delay of a CLB-Max 0.53 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3328 3328
Number of Equivalent Gates 1500000 1500000
Number of Inputs 333 333
Number of Logic Cells 29952 29952
Number of Outputs 333 333
Number of Terminals 456 456
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 3328 CLBS, 1500000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S1500-5FGG456C with alternatives

Compare XC3S1500L-4FG456C with alternatives