XC3S1500-5FGG456C vs XC3S1400AN-5FGG484C feature comparison

XC3S1500-5FGG456C AMD Xilinx

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XC3S1400AN-5FGG484C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, LEAD FREE, FBGA-456 BGA, BGA484,22X22,40
Pin Count 456 484
Reach Compliance Code compliant unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 725 MHz 770 MHz
Combinatorial Delay of a CLB-Max 0.53 ns 0.62 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B484
JESD-609 Code e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3
Number of CLBs 3328 2816
Number of Equivalent Gates 1500000 1400000
Number of Inputs 333 375
Number of Logic Cells 29952 25344
Number of Outputs 333 288
Number of Terminals 456 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 3328 CLBS, 1500000 GATES 2816 CLBS, 1400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S1500-5FGG456C with alternatives

Compare XC3S1400AN-5FGG484C with alternatives