XC3S1500-5FGG320C vs XC3S1500-5FG320C feature comparison

XC3S1500-5FGG320C AMD Xilinx

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XC3S1500-5FG320C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 19 X 19 MM, LEAD FREE, FBGA-320 19 X 19 MM, FBGA-320
Pin Count 320 320
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 36 Weeks 36 Weeks
Clock Frequency-Max 725 MHz 725 MHz
Combinatorial Delay of a CLB-Max 0.53 ns 0.53 ns
JESD-30 Code S-PBGA-B320 S-PBGA-B320
JESD-609 Code e1 e0
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3328 3328
Number of Equivalent Gates 1500000 1500000
Number of Inputs 221 221
Number of Logic Cells 29952 29952
Number of Outputs 221 221
Number of Terminals 320 320
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 3328 CLBS, 1500000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA320,18X18,40 BGA320,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 1 1