XC3S1400AN-4FGG484I vs XC3S1500-4FGG456I feature comparison

XC3S1400AN-4FGG484I AMD Xilinx

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XC3S1500-4FGG456I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-484 23 X 23 MM, LEAD FREE, FBGA-456
Pin Count 484 456
Reach Compliance Code unknown compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.61 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B456
Length 23 mm 23 mm
Number of CLBs 2816 3328
Number of Equivalent Gates 1400000 1500000
Number of Inputs 375 333
Number of Logic Cells 25344 29952
Number of Outputs 288 333
Number of Terminals 484 456
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 2816 CLBS, 1400000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 23 mm 23 mm
Base Number Matches 1 1
Pbfree Code Yes
Factory Lead Time 52 Weeks
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

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Compare XC3S1500-4FGG456I with alternatives