XC3S1400A-4FG484I vs XC3S1500-4FGG456C feature comparison

XC3S1400A-4FG484I AMD Xilinx

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XC3S1500-4FGG456C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-484 23 X 23 MM, LEAD FREE, FBGA-456
Pin Count 484 456
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks 52 Weeks
Clock Frequency-Max 667 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.61 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B456
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 3328
Number of Equivalent Gates 1400000 1500000
Number of Inputs 375 333
Number of Logic Cells 25344 29952
Number of Outputs 288 333
Number of Terminals 484 456
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2816 CLBS, 1400000 GATES 3328 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S1400A-4FG484I with alternatives

Compare XC3S1500-4FGG456C with alternatives