XC3S1400A-4FG484C vs XC3S1400AN-5FG484C feature comparison

XC3S1400A-4FG484C AMD Xilinx

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XC3S1400AN-5FG484C AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-484 FBGA-484
Pin Count 484 484
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks
Clock Frequency-Max 667 MHz 770 MHz
Combinatorial Delay of a CLB-Max 0.71 ns 0.62 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2816 2816
Number of Equivalent Gates 1400000 1400000
Number of Inputs 375 375
Number of Logic Cells 25344 25344
Number of Outputs 288 288
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2816 CLBS, 1400000 GATES 2816 CLBS, 1400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XC3S1400A-4FG484C with alternatives

Compare XC3S1400AN-5FG484C with alternatives