XC2V500-5FGG456I vs XC2V500-5FG456C feature comparison

XC2V500-5FGG456I AMD Xilinx

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XC2V500-5FG456C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456
Pin Count 456 456
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 750 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.39 ns
JESD-30 Code S-PBGA-B456 S-PBGA-B456
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 768 768
Number of Equivalent Gates 500000 500000
Number of Inputs 264 264
Number of Logic Cells 6912 6912
Number of Outputs 264 264
Number of Terminals 456 456
Organization 768 CLBS, 500000 GATES 768 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,22X22,40 BGA456,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC2V500-5FGG456I with alternatives

Compare XC2V500-5FG456C with alternatives