XC2V500-5FG256I vs XC2V500-5FGG256C feature comparison

XC2V500-5FG256I AMD Xilinx

Buy Now Datasheet

XC2V500-5FGG256C AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-034AAF-1, FBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 750 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.39 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 768 768
Number of Equivalent Gates 500000 500000
Number of Inputs 172 172
Number of Logic Cells 6912 6912
Number of Outputs 172 172
Number of Terminals 256 256
Organization 768 CLBS, 500000 GATES 768 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC2V500-5FG256I with alternatives

Compare XC2V500-5FGG256C with alternatives