XC2V1500-5FF896I vs XC2V1500-6FFG896C feature comparison

XC2V1500-5FF896I AMD Xilinx

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XC2V1500-6FFG896C AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896
Pin Count 896 896
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 820 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.35 ns
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e0 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1920 1920
Number of Equivalent Gates 1500000 1500000
Number of Inputs 528
Number of Logic Cells 17280
Number of Outputs 528
Number of Terminals 896 896
Organization 1920 CLBS, 1500000 GATES 1920 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC2V1500-5FF896I with alternatives

Compare XC2V1500-6FFG896C with alternatives