XC2V1500-5BG575I
vs
XC2V1500-4BGG575I
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
|
31 X 31 MM, 1.27 MM PITCH, LEAD FREE, MS-034BAN-1, BGA-575
|
| Pin Count |
575
|
575
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
750 MHz
|
650 MHz
|
| Combinatorial Delay of a CLB-Max |
0.39 ns
|
0.44 ns
|
| JESD-30 Code |
S-PBGA-B575
|
S-PBGA-B575
|
| JESD-609 Code |
e0
|
e1
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
1920
|
1920
|
| Number of Equivalent Gates |
1500000
|
1500000
|
| Number of Inputs |
392
|
392
|
| Number of Logic Cells |
17280
|
17280
|
| Number of Outputs |
392
|
392
|
| Number of Terminals |
575
|
575
|
| Organization |
1920 CLBS, 1500000 GATES
|
1920 CLBS, 1500000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA575,24X24,50
|
BGA575,24X24,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
2.6 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC2V1500-5BG575I with alternatives
Compare XC2V1500-4BGG575I with alternatives