WF12F3571BALQ vs RP73D2B3K57ATDG feature comparison

WF12F3571BALQ Walsin Technology Corporation

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RP73D2B3K57ATDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature HIGH PRECISION HIGH PRECISION
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200 MIL-STD-202
Resistance 3570 Ω 3570 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 15 ppm/°C 15 ppm/°C
Terminal Finish TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.05%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Series RP73

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