VSC8641XKO
vs
88E1111-B2-BAB1C000
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
VITESSE SEMICONDUCTOR CORP
|
MARVELL SEMICONDUCTOR INC
|
Part Package Code |
QFP
|
BGA
|
Package Description |
12 X 12 MM, 1.60 MM HEIGHT, 0.40 MM PITCH, LEAD FREE, PLASTIC, LQFP-100
|
ROHS COMPLIANT, TFBGA-117
|
Pin Count |
100
|
117
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Data Rate |
1000000 Mbps
|
|
JESD-30 Code |
S-PQFP-G100
|
R-PBGA-B117
|
JESD-609 Code |
e3
|
e1
|
Length |
12 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
117
|
Number of Transceivers |
1
|
1
|
Operating Temperature-Max |
90 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLFQFP
|
LBGA
|
Package Equivalence Code |
QFP100,.55SQ,16
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.6 mm
|
1.54 mm
|
Supply Voltage-Nom |
1.2 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.4 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
12 mm
|
10 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Technology |
|
CMOS
|
|
|
|
Compare VSC8641XKO with alternatives
Compare 88E1111-B2-BAB1C000 with alternatives