TMS320DM6467ZUTA
vs
TMS320DM6467ZUTV
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FCBGA-529
|
FBGA, BGA529,23X23,32
|
| Pin Count |
529
|
529
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY
|
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY
|
| Bit Size |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| JESD-30 Code |
S-PBGA-B529
|
S-PBGA-B529
|
| Length |
19 mm
|
19 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Terminals |
529
|
529
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA529,23X23,32
|
BGA529,23X23,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
32768
|
32768
|
| Seated Height-Max |
3.3 mm
|
3.3 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
19 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
Digital Media SoC
|
Digital Media SoC
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare TMS320DM6467ZUTA with alternatives
Compare TMS320DM6467ZUTV with alternatives