SMBJ170CA
vs
MXLSMBJ170CAE3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SMB, 2 PIN
|
ROHS COMPLIANT, PLASTIC, SMBJ, 2 PIN
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Breakdown Voltage-Min |
189 V
|
189 V
|
| Breakdown Voltage-Nom |
199 V
|
199 V
|
| Clamping Voltage-Max |
275 V
|
275 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-214AA
|
DO-214AA
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-J2
|
| Non-rep Peak Rev Power Dis-Max |
600 W
|
600 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Reference Standard |
IEC-61000-4-2, 4-4, 4-5; MIL-STD-750; MIL-STD-883
|
|
| Rep Pk Reverse Voltage-Max |
170 V
|
170 V
|
| Reverse Current-Max |
0.2 µA
|
|
| Reverse Test Voltage |
170 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Form |
C BEND
|
J BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Breakdown Voltage-Max |
|
209 V
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Power Dissipation-Max |
|
1.38 W
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare SMBJ170CA with alternatives
Compare MXLSMBJ170CAE3 with alternatives