SF12F3571BTLQ vs RP73D2B3K57BTDF feature comparison

SF12F3571BTLQ Walsin Technology Corporation

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RP73D2B3K57BTDF TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature ANTI-SULFUR, PRECISION PRECISION
Construction Rectangular Rectangular
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, Paper, 7 Inch TR
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200
Resistance 3570 Ω 3570 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 15 ppm/°C 15 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Factory Lead Time 8 Weeks
Samacsys Manufacturer TE Connectivity
Package Shape RECTANGULAR PACKAGE
Physical Dimension 3.05mm x 1.55mm x .55mm

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