S25FL064LABMFI010
vs
M25PX64SOVME3TB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MICRON TECHNOLOGY INC
|
| Package Description |
SOIC-8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.1.A
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Date Of Intro |
2016-09-26
|
|
| Additional Feature |
IT ALSO HAVE X1 MEMORY WIDTH
|
|
| Alternate Memory Width |
2
|
|
| Clock Frequency-Max (fCLK) |
108 MHz
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| JESD-609 Code |
e3
|
|
| Length |
5.28 mm
|
|
| Memory Density |
67108864 bit
|
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
8388608 words
|
|
| Number of Words Code |
8000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8MX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE
|
|
| Parallel/Serial |
SERIAL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
2.7 V
|
| Seated Height-Max |
2.16 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
5.28 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare S25FL064LABMFI010 with alternatives
Compare M25PX64SOVME3TB with alternatives