RC1608J000ES
vs
MC0603WG00000T5E-TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SPC TECHNOLOGY/ MULTICOMP
|
| Package Description |
SMT, 0603
|
CHIP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e3
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.45 mm
|
0.45 mm
|
| Package Length |
1.6 mm
|
1.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.8 mm
|
0.8 mm
|
| Packing Method |
TR, Punched Paper, 10 Inch
|
TR
|
| Resistance |
0.05 Ω
|
|
| Resistor Type |
FIXED RESISTOR
|
JUMPER
|
| Series |
RC(GENERAL)
|
|
| Size Code |
0603
|
0603
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
TIN OVER NICKEL
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.30
|
| Additional Feature |
|
RATED CURRENT: 2A
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Power Dissipation (P) |
|
0.063 W
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
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