MT47H128M16RT-25EAIT:CTR vs MT47H128M16RT-25EAAT:C feature comparison

MT47H128M16RT-25EAIT:CTR Micron Technology Inc

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MT47H128M16RT-25EAAT:C Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description , TFBGA, BGA84,9X15,32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Memory IC Type DDR2 DRAM DDR2 DRAM
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 84
HTS Code 8542.32.00.36
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.4 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84
JESD-609 Code e1
Length 12.5 mm
Memory Density 2147483648 bit
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 84
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 128MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Screening Level AEC-Q100
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.012 A
Supply Current-Max 0.33 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 9 mm

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