MT41K128M16JT-125AIT:KT vs W632GU6KB12I feature comparison

MT41K128M16JT-125AIT:KT Micron Technology Inc

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W632GU6KB12I Winbond Electronics Corp

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Part Life Cycle Code Active Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
JESD-609 Code e1
Memory IC Type DDR3L DRAM DDR3L DRAM
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Base Number Matches 1 1
Rohs Code Yes
Part Package Code BGA
Package Description TFBGA, BGA96,9X16,32
Pin Count 96
HTS Code 8542.32.00.36
Samacsys Manufacturer Winbond
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.225 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B96
Length 13 mm
Memory Density 2147483648 bit
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.019 A
Supply Current-Max 0.38 mA
Supply Voltage-Max (Vsup) 1.45 V
Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 9 mm

Compare MT41K128M16JT-125AIT:KT with alternatives

Compare W632GU6KB12I with alternatives