MPC8270CVRMIBA vs MPC8313CVRADDC feature comparison

MPC8270CVRMIBA NXP Semiconductors

Buy Now Datasheet

MPC8313CVRADDC NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks 52 Weeks
Samacsys Manufacturer NXP NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 266 MHz 66.67 MHz
External Data Bus Width 64 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2 e2
Length 27 mm 27 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 66.67 MHz 266 MHz
Supply Voltage-Max 1.6 V 1.05 V
Supply Voltage-Min 1.45 V 0.95 V
Supply Voltage-Nom 1.5 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 1
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL

Compare MPC8270CVRMIBA with alternatives

Compare MPC8313CVRADDC with alternatives