MPC8270CVRMIBA vs MPC8313ECZQADDC feature comparison

MPC8270CVRMIBA Freescale Semiconductor

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MPC8313ECZQADDC NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516 HBGA,
Pin Count 516
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 15
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 266 MHz
External Data Bus Width 64 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2 e0
Length 27 mm 27 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 66.67 MHz 266 MHz
Supply Voltage-Max 1.6 V 1.05 V
Supply Voltage-Min 1.45 V 0.95 V
Supply Voltage-Nom 1.5 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1

Compare MPC8270CVRMIBA with alternatives

Compare MPC8313ECZQADDC with alternatives