MIMX8MM6CVTKZAA
vs
935378345557
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
FCBGA-486
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Factory Lead Time |
16 Weeks
|
|
| Date Of Intro |
2019-02-21
|
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
24MHZ NOM CRYSTAL FREQ AVAILABLE
|
24MHZ NOM CRYSTAL FREQ AVAILABLE
|
| Boundary Scan |
YES
|
YES
|
| Bus Compatibility |
ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
|
ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
|
| JESD-30 Code |
S-PBGA-B486
|
S-PBGA-B486
|
| JESD-609 Code |
e2
|
e2
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
16
|
16
|
| Number of Terminals |
486
|
486
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA486,27X27,20
|
BGA486,27X27,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (words) |
288K
|
288K
|
| Seated Height-Max |
1.25 mm
|
1.25 mm
|
| Supply Voltage-Max |
1 V
|
1 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
0.95 V
|
0.95 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
TIN SILVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
|
|
|