MCP73871-2AAI/ML
vs
MP2637GR-Z
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MONOLITHIC POWER SYSTEMS INC
|
| Part Package Code |
QFN
|
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
6 Weeks
|
24 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Monolithic Power Systems (MPS)
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N20
|
S-XQCC-N24
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VQCCN
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max (Isup) |
3.75 mA
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
4.479 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5.2 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Threshold Voltage-Nom |
+4.2V
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
QFN-24
|
|
|
|
Compare MCP73871-2AAI/ML with alternatives
Compare MP2637GR-Z with alternatives