MCP2518FDT-E/SL
vs
MCP2518FDT-H/SLVAO
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SOIC-14
|
SOIC-14
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
SPI
|
SPI
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
Communication Protocol |
SYNC; BIT ;BYTE
|
SYNC; BIT ;BYTE
|
Data Transfer Rate-Max |
1 MBps
|
1 MBps
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
e3
|
Length |
8.65 mm
|
8.65 mm
|
Low Power Mode |
YES
|
YES
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
150 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP14,.24
|
SOP14,.24
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Current-Max |
20 mA
|
20 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.9 mm
|
3.9 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, CAN
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
External Data Bus Width |
|
|
Screening Level |
|
AEC-Q100; TS 16949
|
|
|
|
Compare MCP2518FDT-E/SL with alternatives
Compare MCP2518FDT-H/SLVAO with alternatives