MCP2515-I/SORB2
vs
MCP2515-E/STVAO
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SOIC-18
|
TSSOP-20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
SPI
|
SPI
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| Communication Protocol |
SYNC; BIT ;BYTE
|
SYNC; BIT ;BYTE
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G18
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
11.55 mm
|
6.5 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
18
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP18,.4
|
TSSOP20,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Screening Level |
TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
2.65 mm
|
1.2 mm
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP2515-I/SORB2 with alternatives
Compare MCP2515-E/STVAO with alternatives