MC74HC4050DD vs TC74HC4050AFN-ELP feature comparison

MC74HC4050DD Motorola Mobility LLC

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TC74HC4050AFN-ELP Toshiba America Electronic Components

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V; WITH EXTENDED INPUT VOLTAGE
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 26 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 3 1
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HC4050DD with alternatives

Compare TC74HC4050AFN-ELP with alternatives