MC74AC139DR2G
vs
HD74AC139ARPEL
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC 16 LEAD
|
SOIC
|
| Package Description |
SOIC-16
|
SOP, SOP16,.25
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
751B-05
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| JESD-609 Code |
e3
|
|
| Logic IC Type |
DEMUX/DECODER
|
2-LINE TO 4-LINE DECODER
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Family |
|
AC
|
| Input Conditioning |
|
STANDARD
|
| JESD-30 Code |
|
R-PDSO-G16
|
| Length |
|
9.9 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.012 A
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
INVERTED
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
13 ns
|
| Propagation Delay (tpd) |
|
13 ns
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3.95 mm
|
|
|
|
Compare MC74AC139DR2G with alternatives
Compare HD74AC139ARPEL with alternatives