MC7448THX1267ND vs MC7448VU867ND feature comparison

MC7448THX1267ND NXP Semiconductors

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MC7448VU867ND NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.1 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 36
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 200 MHz 867 MHz
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-CBGA-B360 S-CBGA-N360
JESD-609 Code e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA LGA
Package Equivalence Code BGA360,19X19,50 BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 1267 MHz 867 MHz
Supply Voltage-Max 1.1 V 1.05 V
Supply Voltage-Min 1 V 0.95 V
Supply Voltage-Nom 1.05 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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