MC56F8323VFBE vs MC56F8323MFBE feature comparison

MC56F8323VFBE NXP Semiconductors

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MC56F8323MFBE NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, PLASTIC, LQFP-64 ROHS COMPLIANT, PLASTIC, LQFP-64
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
Barrel Shifter YES YES
Boundary Scan YES YES
Clock Frequency-Max 120 MHz 120 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm 10 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 64 64
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1