MAX3872ETJ+T
vs
SY87700ALZG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
SOIC-28
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Applications |
SDH; SONET
|
ATM; SDH; SONET
|
| JESD-30 Code |
S-XQCC-N32
|
R-PDSO-G28
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
17.93 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
SOP28,.4
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
2.65 mm
|
| Supply Current-Max |
0.215 mA
|
160 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Telecom IC Type |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
7.52 mm
|
| Base Number Matches |
2
|
3
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare MAX3872ETJ+T with alternatives
Compare SY87700ALZG with alternatives