MAX3872ETJ+T
vs
MAX3875EHJ
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
5 X 5 MM, 1 MM HEIGHT, EXPOSED PAD, TQFP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Applications |
SDH; SONET
|
ATM; SDH; SONET
|
| JESD-30 Code |
S-XQCC-N32
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
e0
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TFQFP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
TQFP32,.28SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
1.2 mm
|
| Supply Current-Max |
0.215 mA
|
167 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
3
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare MAX3872ETJ+T with alternatives
Compare MAX3875EHJ with alternatives