LPC2220FET144/G,55
vs
LPC2220FBD144
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
12 X 12 MM, 0.80 MM PITCH, PLASTIC, MO-216, SOT-569-1, TFBGA-144
|
|
| Pin Count |
144
|
|
| Manufacturer Package Code |
SOT569-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Has ADC |
YES
|
|
| Additional Feature |
ALSO REQUIRES 3.3 V SUPPLY
|
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
|
| CPU Family |
ARM7
|
|
| Clock Frequency-Max |
50 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
32
|
|
| JESD-30 Code |
S-PBGA-B144
|
|
| JESD-609 Code |
e1
|
|
| Length |
12 mm
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of I/O Lines |
76
|
|
| Number of Terminals |
144
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFBGA
|
|
| Package Equivalence Code |
BGA144,13X13,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
65536
|
|
| Seated Height-Max |
1.2 mm
|
|
| Speed |
75 MHz
|
|
| Supply Voltage-Max |
1.95 V
|
|
| Supply Voltage-Min |
1.65 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
12 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare LPC2220FET144/G,55 with alternatives