LM358N vs LM358N feature comparison

LM358N HTC Korea

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LM358N NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer TAEJIN TECHNOLOGY CO LTD NXP SEMICONDUCTORS
Package Description DIP-8 0.300 INCH, PLASTIC, DIP-8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.5 µA 0.5 µA
Common-mode Reject Ratio-Nom 80 dB 70 dB
Frequency Compensation YES
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Low-Bias NO
Low-Offset NO
Micropower NO
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power NO
Programmable Power NO
Slew Rate-Nom 0.7 V/us 0.3 V/us
Supply Current-Max 2 mA
Supply Voltage Limit-Max 45 V 32 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 700 1000
Wideband NO
Base Number Matches 1 1
Part Package Code DIP
Pin Count 8
Length 9.5 mm
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Technology BIPOLAR
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare LM358N with alternatives

Compare LM358N with alternatives