LM358AN/NOPB
vs
EL2224CN
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.2 µA
|
|
| Bias Current-Max (IIB) @25C |
0.1 µA
|
|
| Common-mode Reject Ratio-Min |
65 dB
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
5000 µV
|
|
| JESD-30 Code |
R-PDIP-T8
|
|
| JESD-609 Code |
e3
|
|
| Length |
9.817 mm
|
|
| Low-Offset |
NO
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
|
| Slew Rate-Nom |
0.1 V/us
|
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage Limit-Max |
32 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Unity Gain BW-Nom |
1000
|
|
| Voltage Gain-Min |
25000
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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