LM158AN vs LM358J feature comparison

LM158AN NXP Semiconductors

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LM358J STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP STMICROELECTRONICS
Part Package Code DIP DIP
Package Description , DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.1 µA 0.2 µA
Common-mode Reject Ratio-Nom 85 dB 60 dB
Input Offset Voltage-Max 4000 µV 9000 µV
JESD-30 Code R-PDIP-T8 R-CDIP-T8
Number of Functions 2 2
Number of Terminals 8 8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000 1100
Base Number Matches 4 7
Pbfree Code No
Rohs Code No
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.1 µA
Frequency Compensation YES
JESD-609 Code e0
Low-Offset NO
Neg Supply Voltage-Nom (Vsup)
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Code DIP
Package Equivalence Code DIP8,.3
Seated Height-Max 5.08 mm
Slew Rate-Min 0.3 V/us
Slew Rate-Nom 0.6 V/us
Supply Current-Max 2 mA
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Voltage Gain-Min 25000
Width 7.62 mm

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