KA358 vs LM358N/NOPB feature comparison

KA358 Samsung Semiconductor

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LM358N/NOPB National Semiconductor Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, DIP-8 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.5 µA 0.05 µA
Bias Current-Max (IIB) @25C 0.25 µA 0.25 µA
Common-mode Reject Ratio-Nom 80 dB 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.2 mm 9.817 mm
Low-Offset NO NO
Neg Supply Voltage Limit-Max -16 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 2 mA 2 mA
Supply Voltage Limit-Max 16 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Min 15000 25000
Width 7.62 mm 7.62 mm
Base Number Matches 3 2
Rohs Code Yes
Common-mode Reject Ratio-Min 65 dB
JESD-609 Code e3
Moisture Sensitivity Level 1
Neg Supply Voltage-Nom (Vsup)
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Slew Rate-Nom 0.1 V/us
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1000

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