JANSD2N2907AUB vs JANSD2N2907AUBC feature comparison

JANSD2N2907AUB Microchip Technology Inc

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JANSD2N2907AUBC Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description CERAMIC PACKAGE-4 CERAMIC PACKAGE-4
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.95
Collector Current-Max (IC) 0.6 A 0.6 A
Collector-Emitter Voltage-Max 60 V 60 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 50 50
JESD-30 Code R-CDSO-N3 R-CDSO-N3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/291 MIL-19500/291
Surface Mount YES YES
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 300 ns 300 ns
Turn-on Time-Max (ton) 45 ns 45 ns
Base Number Matches 2 1
Pin Count 4

Compare JANSD2N2907AUB with alternatives

Compare JANSD2N2907AUBC with alternatives