JANS1N5819-1
vs
EG1Z
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
RUGAO DACHANG ELECTRONIC CO LTD
|
Package Description |
HERMETIC SEALED PACKAGE-2
|
O-PALF-W2
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
32 Weeks
|
|
Additional Feature |
HIGH RELIABILITY
|
|
Application |
GENERAL PURPOSE
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.49 V
|
1.7 V
|
JEDEC-95 Code |
DO-41
|
DO-41
|
JESD-30 Code |
O-LALF-W2
|
O-PALF-W2
|
JESD-609 Code |
e0
|
|
Non-rep Pk Forward Current-Max |
25 A
|
15 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-55 °C
|
Output Current-Max |
1 A
|
0.8 A
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Qualified
|
|
Reference Standard |
MIL-PRF-19500; MIL-STD-750
|
|
Rep Pk Reverse Voltage-Max |
45 V
|
200 V
|
Reverse Current-Max |
50 µA
|
|
Reverse Test Voltage |
45 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
SCHOTTKY
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.80
|
Reverse Recovery Time-Max |
|
0.05 µs
|
|
|
|
Compare JANS1N5819-1 with alternatives
Compare EG1Z with alternatives