HEF4013BT-Q100 vs MC14013BAL feature comparison

HEF4013BT-Q100 NXP Semiconductors

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MC14013BAL Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 8.65 mm 19.495 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 220 ns 350 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 7.62 mm
fmax-Min 20 MHz 2 MHz
Base Number Matches 3 3
Part Package Code DIP
Pin Count 14
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 450 ns
Qualification Status Not Qualified

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