FDSS2407
vs
EPC8009
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
EFFICIENT POWER CONVERSION CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SO-8
|
UNCASED CHIP, R-XXUC-X6
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
8LD, SOIC,JEDEC MS-012, .150" NARROW BODY, DUAL DAP
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Avalanche Energy Rating (Eas) |
140 mJ
|
|
| Configuration |
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
62 V
|
65 V
|
| Drain Current-Max (ID) |
3.3 A
|
2.7 A
|
| Drain-source On Resistance-Max |
0.11 Ω
|
0.13 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PDSO-G8
|
R-XXUC-X6
|
| JESD-609 Code |
e3
|
e2
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
2
|
1
|
| Number of Terminals |
8
|
6
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
2.27 W
|
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER
|
| Terminal Form |
GULL WING
|
UNSPECIFIED
|
| Terminal Position |
DUAL
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
GALLIUM NITRIDE
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
ULTRA LOW RESISTANCE
|
| Pulsed Drain Current-Max (IDM) |
|
7.5 A
|
|
|
|