DSC557-0334FI1T
vs
DSC557-0334FI1-T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ABRACON LLC
|
| Package Description |
QFN-14
|
QFN-14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
ELIMINATED THE EXT QUARTZ CRYSTAL AND USED MEMS CLOCK GENERATORS AS EXT CLOCK
|
ELIMINATED THE EXT QUARTZ CRYSTAL AND USED MEMS CLOCK GENERATORS AS EXT CLOCK
|
| JESD-30 Code |
R-XQCC-N14
|
R-XQCC-N14
|
| Length |
3.2 mm
|
3.2 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
460 MHz
|
460 MHz
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC14,.1X.12,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Current-Max |
23 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
2.5 mm
|
2.5 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, MEMS
|
CLOCK GENERATOR, MEMS
|
| Base Number Matches |
2
|
1
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare DSC557-0334FI1T with alternatives
Compare DSC557-0334FI1-T with alternatives