BZV55-C18,135
vs
BZV55C18
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
NEXPERIA
|
HY ELECTRONIC CORP
|
| Part Package Code |
MELF
|
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
SOD80C
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Samacsys Manufacturer |
Nexperia
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
200 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.4 W
|
|
| Reference Standard |
IEC-60134
|
|
| Reference Voltage-Nom |
18 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
5 mA
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare BZV55-C18,135 with alternatives
Compare BZV55C18 with alternatives