BAS16L
vs
BAS16L,315
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.715 V
|
0.715 V
|
| JESD-609 Code |
e3
|
e3
|
| Non-rep Pk Forward Current-Max |
4 A
|
0.5 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
0.5 A
|
0.215 A
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Base Number Matches |
7
|
2
|
| Part Package Code |
|
DFN
|
| Package Description |
|
1 X 0.60 MM, 0.50 MM HEIGHT, ULTRA SMALL, PLASTIC PACKAGE-2
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
SOD882
|
| HTS Code |
|
8541.10.00.70
|
| Diode Element Material |
|
SILICON
|
| JESD-30 Code |
|
R-PBCC-N2
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
CHIP CARRIER
|
| Power Dissipation-Max |
|
0.25 W
|
| Qualification Status |
|
Not Qualified
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAS16L,315 with alternatives